Semiconductor device and manufacturing method thereof, and camera module including the same

ABSTRACT

A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. application Ser. No.12/240,313, filed on Sep. 29, 2008 now U.S. Pat. No. 7,973,323, claimingpriority of Japanese Patent Application No. 2007-317305, filed on Dec.7, 2007, the entire contents of each of which are hereby incorporated byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a semiconductor device having a semiconductorelement mounted on an insulating base, such as an optical device like asolid-state imaging device using an imaging element such as a CCD(Charge Coupled Device) and a CMOS (Complementary Metal-OxideSemiconductor), and a manufacturing method of the semiconductor device.

2. Related Art

With reduction in size of electronic equipments such as portableterminals, reduction in size of semiconductor devices has been demandedin recent years. In addition to reduction in size and thickness ofsemiconductor devices, quality of a reference surface is also importantfor secondary mounting of a semiconductor device onto a set to which thesemiconductor device is to be mounted. Improvement in quality of amounting surface has therefore also been demanded. Among semiconductordevices, this market demand is strong especially for optical devicessuch as solid-state imaging devices that have been widely used in videocameras and still cameras.

FIGS. 5A and 5B show a structure of a conventional solid-stage imagingdevice. FIG. 5A is a plan view of the solid-state imaging device. FIG.5B is a cross-sectional view taken along line Vb-Vb′ in FIG. 5A.

The solid-state imaging device is formed by using an insulating base 1.A frame 2 is provided on the periphery of the insulating base 1, and asurface of the insulating base 1 in a region located inside the frame 2serves as an element mounting surface 3. A plurality of wiring portions4 are extended from the periphery of the element mounting surface 3 to abottom surface of the insulating base 1, and an optical function element6 is fixed to the element mounting surface 3 by an adhesive 5. Theoptical function element 6 and the wiring portions 4 are electricallyconnected to each other by thin metallic wires 7. A light-transmittingprotector 9 is bonded on the optical function element 6 by an adhesive8, and a region between the frame 2 and the optical function element 6is filled with a sealing resin 10 so as to bury the thin metallic wires7. A top surface of the frame 2 is a mounting reference surface 13. Notethat FIG. 5A is shown in a state of seeing through the sealing resin 10.

In such a solid-state imaging device, a process of dropping a liquidsealing resin by a dropping nozzle has been commonly used to fill theregion between the frame 2 and the protector 9 and the optical functionelement 6 with the sealing resin 10. A purpose of filling the regionwith the sealing resin 10 is to prevent malfunction of the opticaldevice and degradation of capability and functions of the optical devicefrom occurring due to, for example, incidence of stray light onto alight-receiving surface of the optical function element 6. In order toaccomplish this purpose, it is necessary to fill the sealing resin 10 upto an upper end face of the light-transmitting protector 9 bonded on theoptical function element 6 by the adhesive 8.

Japanese Laid-Open Patent Publication No. 2006-186288 proposes a methodof filling a liquid sealing resin by dropping, and bringing a packageforming member into contact with a frame and the liquid sealing resin.

SUMMARY OF THE INVENTION

However, reduction in size has been required for optical deviceapparatuses and the frame 2 needs to be reduced in size to implementsmaller optical devices. When the frame 2 has a reduced size and aliquid sealing resin is dropped by a dropping nozzle as described above,the liquid sealing resin may run onto the mounting reference surface 13,that is, the top surface of the frame 2, causing degradation in quality.This happens because the liquid sealing resin has a viscosity as low asabout 1 Pa·s (pascal second). Due to the low viscosity of the liquidsealing resin, ripples are generated at the surface of the liquidsealing resin and the liquid sealing resin runs onto the mountingreference surface 13 at the moment the dropping nozzle is removed fromthe applied surface right after dropping of the liquid sealing resin 10into the region between the frame 2 and the protector 9 and the opticalfunction element 6 is completed.

Most optical devices are mounted on a camera module and the like byusing the mounting reference surface 13 as a height reference. Suchoverflow of the sealing resin 10 onto the mounting reference surface 13and the like therefore cause defective packaging of a camera module andthe like. This problem becomes more significant as the optical device(and the frame 2) becomes smaller.

In order to suppress such ripple generation, it is possible to reducethe inner and outer diameters of the dropping nozzle for dropping theliquid sealing resin. This can suppress spreading of ripples andtherefore can reduce the chance of the liquid sealing resin running ontothe mounting reference surface 13. In this case, however, the droppingtime of the sealing resin is increased, causing increase inmanufacturing cost. This method therefore has not been commonly used.

Solving the above problem has been a challenge for reduction in size ofthe optical device apparatuses having a frame.

Description will now be given to the invention made by the inventors ofthe present application in view of the above problem. In other words,description will be given to a semiconductor device capable of filling aregion inside a frame having a reduced size with a liquid sealing resinby a dropping method without causing the liquid sealing resin to runonto a mounting reference surface, a manufacturing method of thesemiconductor device, and a camera module using the semiconductor deviceand the manufacturing method.

A semiconductor device according to the invention includes: aninsulating base; a semiconductor element provided on the insulatingbase; a protector provided on the semiconductor element; and a frameprovided on a periphery of the insulating base and surrounding thesemiconductor element. A region between the frame and the semiconductorelement and the protector is filled with a sealing resin, and at leastone groove is provided in an upper corner portion of the frame on asemiconductor element side of the frame.

According to the semiconductor device of the invention, at least onegroove is provided on the semiconductor element side (inner side) of theframe. This prevents the sealing resin from running onto a top surfaceof the frame when a region inside the frame is filled with the sealingresin. As a result, stable product quality and yield can be obtained fora semiconductor device having a frame with a reduced size. Moreover,since the groove can be formed simultaneously with the frame, themanufacturing cost is not increased by formation of the groove.

It is preferable that the groove is provided so as not to reach theinsulating base in a height direction of the frame.

In other words, the groove is formed so as to extend downward from aninner upper end of the frame partway toward the insulating base (to aposition that does not reach the insulating base). An inner wall of theframe therefore has a stepped portion at the bottom of the groove. Thisstructure enables the sealing resin to run onto the stepped portion andto be retained in the groove when filling the region inside the framewith the sealing resin is completed. As a result, the sealing resin canbe prevented from running onto a top surface of the frame.

It is also preferable that the groove is provided so as to reach theinsulating base in a height direction of the frame.

In this case, the groove continuously extends from the inner upper endof the frame to the insulating base, and the inner wall of the frame hasno stepped portion. In this structure, a longer distance can be obtainedto calm down ripples that are generated when filling of the regioninside the frame with the sealing resin is completed. The sealing resincan therefore be prevented from running onto the top surface of theframe.

Preferably, the semiconductor device further includes: a wiring portionfor external connection provided on the insulating base; and a thinmetallic wire electrically connecting the semiconductor element with thewring portion, and the thin metallic wire is covered by the sealingresin.

This structure ensures electric connection from the semiconductorelement to the outside. Moreover, since the thin metallic wire iscovered by the sealing resin, reliability is improved.

Preferably, the groove has an R-shape, a rectangular shape, or atriangular shape when the semiconductor device is viewedtwo-dimensionally.

An R-shaped (arc-shaped) groove can be easily formed by a round cuttingdrill or the like. A rectangular groove can perform its function evenwhen ripples of the sealing resin are generated in a larger range. Atriangular groove is excellent in absorbing ripples of the sealing resinwithout hindering the flow of the ripples.

It is preferable that the groove is provided so that at least a part ofthe groove reaches an outer wall of the frame.

In this structure, the part of the groove which reaches the outer wallof the frame functions as an air vent. This groove is therefore usefulin resin molding. In this case, the part of the groove which reaches theouter wall of the frame has a sufficiently small dimension so that thesealing resin does not spread outside the frame.

It is also preferable that the groove is provided so as not to reach anouter wall of the frame.

In this structure, the sealing resin will not spread outside the frame.

Preferably, the semiconductor element is at least a light-receiving orlight-emitting optical element and the protector is a light-transmittingmember. The semiconductor device of the invention may thus be an opticaldevice.

A camera module of the invention includes the semiconductor device ofthe invention. Stable product quality and yield can be thus obtained fora camera module using a semiconductor device with a reduced size.

A method for manufacturing a semiconductor device according to theinvention includes the steps of: (a) providing a semiconductor elementon an insulating base; (b) providing a protector on the semiconductorelement; (c) providing, on a periphery of the insulating base, a framesurrounding the semiconductor element and having at least one grooveformed on a semiconductor element side of the frame by removing at leastan upper corner portion of the frame; and (d) filling a region betweenthe frame and the semiconductor element and the protector with a liquidsealing resin by using a dropping nozzle.

In the method for manufacturing a semiconductor device according to theinvention, the sealing resin can be prevented from running onto a topsurface of the frame even when ripples are generated at a surface of thesealing resin when the dropping nozzle is lifted to finish filling ofthe sealing resin. This is because the groove is formed on an upper endof the frame on the semiconductor element side (inner side) of the frameby removing at least the upper corner portion of the frame and thegroove thus formed can accept the sealing resin. As a result,manufacturing yield of the semiconductor device can be improved.Moreover, unlike the case where a thinner dropping nozzle is used, thedropping time of the sealing resin is not increased.

According to the semiconductor device of the invention described above,the groove provided on the inner side of the frame can suppress ripplesthat are generated when the dropping nozzle is removed from the appliedsurface right after dropping of the sealing resin is completed. As aresult, product size reduction and stabilization of quality andmanufacturing yield can be implemented. Moreover, since the groove isformed simultaneously with molding of the frame, formation of the groovedoes not affect the manufacturing cost. The invention is thereforeuseful as a solid-state imaging device for use in small, thin electronicequipments such as digital cameras and camera cellular phones.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view of an optical device 100 according to anembodiment of the invention, and FIG. 1B is a cross-sectional view takenalong line Ib-Ib′ in FIG. 1A;

FIGS. 2A, 2B, and 2C are diagrams illustrating filling of a sealingresin 110 in a manufacturing process of the optical device 100 accordingto an embodiment of the invention;

FIGS. 3A, 3B, and 3C are diagrams illustrating shapes of a cross sectionof a groove which is parallel to an element mounting surface in anoptical device of the invention;

FIGS. 4A, 4B, and 4C are diagrams illustrating shapes of a cross sectionof a groove which is vertical to an element mounting surface in anoptical device of the invention; and

FIG. 5A is a plan view of a conventional optical device, and FIG. 5B isa cross-sectional view taken along line Vb-Vb′ in FIG. 5A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, a semiconductor device according to an embodiment of theinvention will be described with reference to the accompanying drawings.An optical device will be herein explained as an example of thesemiconductor device.

FIGS. 1A and 1B are diagrams showing a structure of an optical device100 according to this embodiment. FIG. 1A is a plan view of the opticaldevice 100, and FIG. 1B is a cross-sectional view taken along lineIb-Ib′ in FIG. 1A.

The optical device 100 is formed by using an insulating base 101 made ofa ceramic, a resin, or the like. A frame 102 is provided on theperiphery of the insulating base 101, and a surface of the insulatingbase 101 in a region located inside the frame 102 serves as an elementmounting surface 103. A plurality of wiring portions 104 made of, forexample, metalized wiring bodies are extended from the periphery of theelement mounting surface 103 to a bottom surface of the insulating base101. An optical function element 106 is fixed to the element mountingsurface 103 by an adhesive 105 such as a silver paste. The opticalfunction element 106 is herein used as an example of a semiconductorelement. The optical function element 106 and the wiring portions 104are electrically connected to each other by thin metallic wires 107 suchas Au (gold) wires. A light-transmitting protector 109 is bonded on theoptical function element 106 by an adhesive 108 such as an UV(ultraviolet) adhesive containing an epoxy resin or the like as a mainmaterial. A region between the frame 102 and the optical functionelement 106 (and the protector 109) is filled with a sealing resin 110containing, for example, an epoxy resin as a main material so as to burythe thin metallic wires 107. Note that a top surface of the frame 102 isa mounting reference surface 113. FIG. 1A is shown in a state of seeingthrough the sealing resin 110.

In the optical device 100 of this embodiment, at least one R-shapedgroove 111 is formed in an inner wall 112 of the frame 102. Morespecifically, the groove 111 is provided on the optical function element106 side of the frame 102 so as to remove at least an upper cornerportion of the frame 102. This is one of the differences from theconventional semiconductor device shown in FIGS. 5A and 5B. Note thatthe R-shaped groove 111 has an R-shaped cross section parallel to theelement mounting surface 103, and is provided so as to reach a top endof the frame 102 but not to reach the insulating base 101. Therefore,the inner wall 112 of the frame 102 has a stepped portion including acorner 111 a at a lower end of the R-shaped groove 111.

The effects of the R-shaped groove 111 will now be described.

In order to manufacture the optical device 100, a structure includingthe insulating base 101, the frame 102 having the R-shaped groove 111,the wiring portions 104, the optical function element 106, and theprotector 109 is first formed, and the wiring portions 104 and theoptical function element 106 are then electrically connected to eachother by the thin metallic wires 107. Thereafter, sealing is performedby using the sealing resin 110.

FIGS. 2A through 2C are cross-sectional views illustrating the step offilling the region between the optical function element 106 and theprotector 109 fixed onto the insulating base 101 and the frame 102 withthe sealing resin 110.

FIG. 2A shows a state before a dropping nozzle 114 is lifted afterdropping is completed in the step of dropping a liquid sealing resin 110onto a region between the optical function element 106 and the protector109 and the frame 102 (hereinafter, this region is referred to as aresin sealing region) by using the dropping nozzle 114.

When the resin sealing region is filled with the sealing resin 110, thedropping nozzle 114 containing the liquid sealing resin 110 is loweredto the resin sealing region. The dropping nozzle 114 draws the resinsealing region while dropping the liquid sealing resin 110 by using anair pressure (in other words, the dropping nozzle 114 is moved asappropriate within the region), whereby the resin sealing region isfilled with the sealing resin 10.

In order to finish filling, an air pressure to the dropping nozzle 114is blocked to stop dropping of the liquid sealing resin 110. FIG. 2Ashows a state right after dropping is thus stopped. A tip of thedropping nozzle 114 is connected to the liquid sealing resin 110 fillingthe resin sealing region. Due to a surface tension of the liquid sealingresin 110, the liquid sealing resin 110 is in contact with the corner111 a of the R-shaped groove 111 provided on the inner wall 112 side ofthe frame 102 and has not entered the R-shaped groove 111.

Note that, although one R-shaped groove 111 and one dropping nozzle 114are shown herein, a plurality of R-shaped grooves 111 and a plurality ofdropping nozzles 114 may be used.

Referring to FIG. 2B, after dropping of the liquid sealing resin 110 isstopped as shown in FIG. 2A, the dropping nozzle 114 is lifted todisconnect the connection between the tip of the dropping nozzle 114 andthe liquid sealing resin 110. The liquid sealing resin 110 has aviscosity as low as, for example, 1 Pa·s. Ripples are thereforegenerated at the surface of the liquid sealing resin 110 filling thesealing resin region at the moment the connection is disconnected.

FIG. 2C shows a state in which the step of dropping the sealing resin iscompleted by lifting the dropping nozzle 114 after the state of FIG. 2B.In this state, the liquid sealing resin 110 has entered the R-shapedgroove 111 in the frame 102 due to the ripples generated at the surfaceof the liquid sealing resin 110 in FIG. 2B. In other words, the liquidsealing resin 110 is kept in the state in contact with the corner 111 aof the R-shaped groove 111 by a surface tension. However, this statecannot be retained due to the generated ripples. As a result, the liquidsealing resin 110 runs over the corner 111 a into the R-shaped groove111.

However, the liquid sealing resin 110 is prevented from running onto themounting reference surface 113, that is, the top surface of the frame102. This is implemented by actively retaining the liquid sealing resin110 in the R-shape groove 111 even through the ripples are generated asillustrated in FIG. 2B. After FIG. 2C, the liquid sealing resin 110 iscured, whereby sealing is completed.

The liquid sealing resin 110 can thus be prevented from running onto themounting reference surface 113. Unlike the prior art, the method of thisembodiment does not require reduction in the inner and outer diametersof the dropping nozzle 114. The time required for dropping is thereforenot increased. Accordingly, the tact time for dropping is not increasedand increase in manufacturing cost can be prevented. Moreover, theR-shaped groove 111 can be formed simultaneously with the frame 102. TheR-shaped groove 111 therefore does not affect the manufacturing cost.

As has been described above, in the semiconductor device and themanufacturing method thereof according to this embodiment, limitation ofsize reduction can be solved and the mounting reference surface 113 canbe retained in an excellent state in a semiconductor device having aframe and being subjected to resin sealing.

Note that the R-shaped groove 111 can be formed at any position on theinner wall 112 side of the frame 102. The point is that the positionwhere the dropping nozzle 114 is lifted to disconnect the connectionwith the liquid sealing resin 110 filling the resin sealing regioncorresponds to the formation position of the R-shaped groove 111. TheR-shaped groove 111 can be formed at a position where processing iseasily performed. Increase in manufacturing cost by providing theR-shaped groove 111 is also avoided in this regard.

In the case where a plurality of dropping nozzles 114 are used toperform resin sealing, a plurality of R-shaped grooves 111 need to beprovided so as to correspond to the dropping nozzles 114, respectively.

It is preferable to lift the dropping nozzle 114 in an oblique directiontoward the R-shaped groove 111 because the influence of ripplesgenerated at the surface of the sealing resin can be increased in thedirection of the R-shaped groove 111.

Hereinafter, the groove 111 having an R-shaped cross section in parallelto the element mounting surface 103 and a groove having another crosssectional shape will be described.

FIG. 3A is a plan view of the optical device 100 described above. Thegroove 111 provided in this optical device 100 has an R-shaped crosssection (in parallel to the element mounting surface 103). Withreduction in size of the semiconductor devices, the mounting referencesurface 113 and the frame 102 are often also reduced in size. By formingthe R-shaped groove 111 according to the shape of ripples generated atthe surface of the liquid sealing resin 110, processing to the frame 102can be performed with the minimum dimensions. In other words, sinceripples are generated with a circular pattern, forming a groove havingan R-shape (arc-shape) enables the function of the groove to be obtainedwith the smallest size.

Moreover, in the case of the R-shaped groove 111, a mold for forming theframe 102 can be processed with a round cutting drill such as an endmill. Therefore, the mold can be easily processed, and it can be saidthat there is no impact on the processing cost of the mold.

FIG. 3B shows an example of a groove 151 having a rectangular crosssection parallel to the element mounting surface 103. In this case, thegroove 151 has a wider inner width than that of the groove 111. Thegroove 151 can therefore perform its function even when the droppingnozzle 114 is lifted at a higher speed and ripples are generated in alarge range. As a result, the lifting speed of the dropping nozzle 114can be increased and productivity can be improved. Moreover, anincreased width of the groove 151 enables a larger amount of liquidsealing resin 110 to be retained in the groove 151. As a result, theeffect of preventing the sealing resin 110 from running onto themounting reference surface 113, that is, the top surface of the frame102 is improved.

FIG. 3C shows an example of a groove 152 having a triangular crosssection parallel to the element mounting surface 103. One side of thetriangle is a dimension of the groove 152 in a region that is in contactwith the inner wall 112 of the frame 102, and an apex located oppositeto this side reaches an outer wall of the frame 102.

Since one apex of the triangular groove 152 reaches the outer wall,ripples generated in the liquid sealing resin can be absorbed withouthindering the flow of the ripples. In other words, the groove 152functions as air vent to release air in resin molding.

In order to prevent the liquid sealing resin from leaking outside theframe 102, the groove 152 has a dimension of about several tens ofmicrometers in the apex portion reaching the outer wall of the frame102.

The mounting reference surface 113 is often reduced with reduction insize of the frame 102. Forming the groove 152 that reaches the outerwall portion of the frame 102 therefore enables ripples to flow smoothlyand also enables the distance required for the ripples to calm down tobe increased to the maximum. As a result, the liquid sealing resin canbe more reliably prevented from running onto the mounting referencesurface 113.

Hereinafter, the shape of a longitudinal cross section (a cross sectionin a height direction of the frame 102) of the groove 111 and the likewill be described.

FIG. 4A shows a longitudinal cross section of the R-shaped groove 111provided in the optical device 100 of the first embodiment. As describedabove, the groove 111 is formed so as to reach the top surface of theframe 102 and not to reach the insulating base 101. A surface 111 b ofthe stepped portion at the bottom of the groove 111 is flat (extends inparallel with the element mounting surface 103). The distance from themounting reference surface 113 to the surface 111 b of the steppedportion is relatively short. Due to a surface tension, the liquidsealing resin 110 is therefore prevented from running over the corner111 a into the groove 111 before the dropping nozzle 114 is lifted.

FIG. 4B, on the other hand, shows a groove 153 whose stepped portion hasa tilted surface 153 b. More specifically, the surface 153 b is tilteddownward from the inner wall 112 side of the frame 102 toward the outerwall side thereof.

In this case, ripples that are generated when the dropping nozzle 114 islifted after dropping of the sealing resin is stopped are more likely tocalm down. This is because the sealing resin running over a corner 153 aonto the surface 153 b of the stepped portion due to the generatedripples easily flows along the tilted surface 153 b.

The groove 153 having a stepped portion with a tilted surface 153 b iscapable of retaining a larger amount of sealing resin 110 than a groovehaving a stepped portion with a flat surface 111 b. The effect ofpreventing the sealing resin 110 from running onto the mountingreference surface 113, that is, the top surface of the frame 102 cantherefore be more reliably obtained. Since the distance from themounting reference surface 113 to the surface 153 b of the steppedportion can be reduced on the inner wall 112 side, the sealing resin 110will not enter the groove 153 before the dropping nozzle 114 is lifted.

As shown in FIG. 4C, a groove 154 that reaches both the mountingreference surface 113 and the insulating base 101 may be formed in theinner wall 112 side of the frame 102. The groove 154 has no steppedportion.

The groove 154 has the same purpose of preventing the sealing resin 110from running onto the mounting reference surface 113, but functionsdifferently from the grooves 111 and 153 having a stepped portion. Inother words, instead of retaining the sealing resin 110 when ripples aregenerated, the groove 154 increases the distance between the inner wall112 of the frame 102 and the optical function element 106 and theprotector 109 and thereby functions so that ripples are more likely tocalm down. This is effective when the height of generated ripples isrelatively low (for example, in the case where the lifting speed of thedropping nozzle 114 is set to relatively low).

Note that various shapes of the cross section parallel with the elementmounting surface 103 shown in FIGS. 3A through 3C and various shapes ofthe longitudinal cross section shown in FIGS. 4A through 4C can becombined as appropriate.

An inexpensive, small, thin optical device and electronic equipmenthaving excellent mounting quality can be provided by implementing thestructure of each solid-state imaging device of the embodimentsdescribed above, the manufacturing method thereof, and mounting of eachsolid-state imaging device onto an electronic equipment such as a cameramodule.

The optical device of the invention is capable of implementing improvedmounting quality in addition to reduction in size and thickness. Theoptical device of the invention is therefore useful as a solid-stateimaging device for use in small, thin electronic equipments such asdigital cameras and camera cellular phones.

1. An optical device comprising: a bottom member; a semiconductorelement disposed on the bottom member; a light-transmitting memberdisposed over the semiconductor element; a side member disposed on thebottom member, the side member surrounding the semiconductor element soas to frame said semiconductor element; a resin filling a space betweenthe side member and the light-transmitting member; and a groove having abottom surface and a side surface, the groove provided in an upper innerperipheral portion of the side member, wherein a top surface of a partof the resin filling the groove is located lower than a top surface of apart of the resin adjoining the light-transmitting member, the bottomsurface of the groove is lower than a bottom surface of thelight-transmitting member, and a length of the bottom surface of thegroove is longer than a length of the side surface of the groove incross-section view.
 2. The optical device according to claim 1, whereinthe groove is provided so as not to reach the bottom member in a heightdirection of the side member.
 3. The optical device according to claim1, wherein the groove is provided so as to reach the bottom member in aheight direction of the side member.
 4. The optical device according toclaim 1, further comprising: a wiring portion for external connectionprovided on the bottom member; and a wire electrically connecting thesemiconductor element with the wring portion, wherein the wire iscovered by the resin.
 5. The optical device according to claim 1,wherein the groove is provided so that at least a part of the groovereaches an outer wall of the side member.
 6. The optical deviceaccording to claim 1, wherein the groove is provided so as not to reachan outer wall of the side member.
 7. The optical device according toclaim 1, wherein the semiconductor element is at least a light-receivingor light-emitting optical element.
 8. A camera module, comprising theoptical device of claim
 7. 9. The optical device according to claim 1,wherein an upper part of the semiconductor element is not covered withthe side member.
 10. The optical device according to claim 1, whereinthe side member includes a first surface, a second surface and a thirdsurface, the first surface and the second surface face oppositely toeach other and the second surface is located at a side of thesemiconductor element, the third surface connects the first surface tothe second surface, and the groove is provided at a corner formed by thesecond surface and the third surface.
 11. The optical device accordingto claim 10, wherein the first surface and the second surface aresubstantially perpendicular to an upper surface of the bottom member,and the third surface is substantially parallel to an upper surface ofthe bottom member.
 12. The optical device according to claim 1, furthercomprising a wire having a first terminal portion, and a second terminalportion, the first terminal portion being connected to the semiconductorelement, and the second terminal portion being connected to a portionwhich is lower than the groove.
 13. The optical device according toclaim 1, further comprising a wire having a first terminal portion, anda second terminal portion, the first terminal portion being connected tothe semiconductor element, and the first terminal portion is higher thana bottom surface of the groove.
 14. The optical device according toclaim 1, further comprising a wire having a first terminal portion, asecond terminal portion and a medium portion, the first terminal portionbeing connected to the semiconductor element, the second terminalportion being opposed to the first terminal portion, and the mediumportion being the highest portion of the wire, and wherein a lengthbetween the first terminal portion and the medium portion is shorterthan a length between the second terminal portion and the mediumportion.
 15. The optical device according to claim 1, wherein the groovehas a bottom surface and a side surface, and a distance between thebottom member and the bottom surface of the groove is longer than alength of the side surface in cross-section view.
 16. The optical deviceaccording to claim 1, wherein the groove has a bottom surface and a sidesurface, and a height of the bottom surface is substantially the same asa height of a surface of the semiconductor element, the surface facingthe light-transmitting member.
 17. The optical device according to claim1, wherein the groove has a bottom surface and a side surface, and aheight of the bottom surface is lower than a height of a top surface ofthe semiconductor element.
 18. The optical device according to claim 1,further comprising a wire having a first terminal portion, and a secondterminal portion located on a side opposite to the first terminalportion, wherein the first terminal portion is connected to thesemiconductor element, and the wire is made of gold.
 19. The opticaldevice according to claim 1, wherein the bottom member is composed of aceramic or a resin.
 20. The optical device according to claim 1, whereinthe groove has a R-shaped portion in plan view.
 21. The optical deviceaccording to claim 1, wherein the semiconductor element is connected tothe bottom member by an adhesive which is composed of silver.
 22. Theoptical device according to claim 1, wherein the groove has first sidesurfaces, the light-transmitting member has second surfaces, and theresin completely covers all of the first side surfaces and all of thesecond side surfaces.
 23. A method for manufacturing an optical device,comprising the steps of: (a) providing a semiconductor element on abottom member; (b) providing a light-transmitting member over thesemiconductor element; (c) providing, a side member on the bottommember, the side member surrounding the semiconductor element so as toframe said semiconductor element, and having a groove formed in an upperinner peripheral portion of the side member; and (d) filling a regionbetween the side member and the light-transmitting member with a resinwherein a top surface of a part of the resin filling the groove islocated lower than a top surface of a part of the resin adjoining thelight-transmitting member, a bottom surface of the groove is lower thana bottom surface of the light-transmitting member, and a length of thebottom surface of the groove is longer than a length of the side surfaceof the groove in cross-section view.
 24. The optical device according toclaim 23, wherein the resin is prevented from entering the groove whenthe resin is dropped from a dropping nozzle, and the resin is allowed toenter the groove after the dropping of the resin is stopped.
 25. Anoptical device comprising: a bottom member; a semiconductor elementdisposed on the bottom member; a light-transmitting member disposed overthe semiconductor element; a side member disposed on the bottom member,the side member surrounding the semiconductor element so as to framesaid semiconductor element; a resin filling a space between the sidemember and the light-transmitting member; and a groove having a bottomsurface and a side surface, the groove provided in an upper innerperipheral portion of the side member, wherein a top surface of a partof the resin filling the groove is located lower than a top surface of apart of the resin adjoining the light-transmitting member, the groovehas first side surfaces, the light-transmitting member has secondsurfaces, and the resin completely covers all of the first side surfacesand all of the second side surfaces.